PI High Temperature Self-Adhesive Labels
Material: High-temperature resistant PI
Heat Resistance: 270°C
Thickness: 25 μm / 50 μm, customizable
Thickness: 0.025 mm ±10%, customizable
Size: Roll width 50 cm × 400 m / 1000 m, customizable
Application: PCB SMT process, tin furnace, and reflow soldering
Designed for general industrial heating processes, these constructions maintain shape, adhesion, and legibility under elevated temperatures and repeated handling. Suitable for components, equipment IDs, and process control tagging.